Electronics Assemblies

Today's electronic components are hotter, smaller and more complex, creating situations where dendritic growth or corrosion can proliferate if the cleaning is not perfect. With the pervasive deployment of BGAs and microBGAs, MCM devices and even denser semiconductor packages, clearances are so tight that aqueous systems simply cannot clean these components without higher spray pressures, extra cleaning agents and longer, more vigorous drying cycles.

The MicroCare specialty fluids clean to the micron and sub-micron range. They target the removal of ionics, organics and particulate. Formulations include flux removing solvents for hard-to-clean lead-free and no-clean fluxes. These fluids get under tight-fitting components and remove corrosive fluxes before they can cause problems. These solvents can also target fingerprint oils, uncured solder paste, some conformal coatings, marking inks and other contaminates.

Some of the MicroCare flux removing formulations for engineered cleaning systems include:

Special note: MicroCare also packages a wide variety of benchtop flux remover products engineered for today’s printed circuit boards. Contact MicroCare for information about these cleaning choices which are optimized for manual cleaning.